For the Inventor, By the Inventor

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Wilmington, MA, United States of America

Rudolph Technologies, Inc.

USPTO Granted Patents = 114

CIPO Patents = 7

EPO Patents = 8

Trademarks = 21

Forward Citations = 536

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143 inventors (with patents filed for the assignee):

John Timothy Strom (12 out of 18 patents)

Mark Harless (10 out of 15 patents)

Cory Watkins (10 out of 19 patents)

4. Michael Kotelyanskii (9 out of 10 patents)

5. Christopher J Morath (8 out of 10 patents)

6. Robert Gregory Wolf (7 out of 9 patents)

7. Ajay Pai (7 out of 7 patents)

8. Tuan D Le (7 out of 7 patents)

9. Kevin Barr (6 out of 6 patents)

10. Raymond Kraft (6 out of 11 patents)

11. Troy Palm (6 out of 6 patents)

12. Robin Mair (6 out of 10 patents)

13. Priya Mukundhan (5 out of 7 patents)

14. Kenneth Durden (4 out of 4 patents)

15. Manjusha Mehendale (4 out of 8 patents)

Core Competencies:

Substrate Handling

Opto-Acoustic Metrology

Semiconductor Metrology

Micro-Fabrication Processes

Wafer Inspection

Probe Card Analysis

Automated Defect Inspection

Surface Acoustic Wave Metrology

Focus Adjustment

Depth Measurement

Polarization Imaging

Yield Management

114 patents: Sort by Forward Citations

1. 10664714 - Substrate handling and identification mechanism (2020-05-26),

2. 10553504 - Inspection of substrates (2020-02-04),

3. 10412311 - Focus adjustment for surface part inspection (2019-09-10),

4. 10209300 - Opto-acoustic metrology of signal attenuating structures (2019-02-19),

5. 10173249 - Calibration of semiconductor metrology systems (2019-01-08),

6. 10024804 - System and method of characterizing micro-fabrication processes (2018-07-17),

7. 10014228 - Method and apparatus to assist the processing of deformed substrates (2018-07-03),

8. 9991176 - Non-destructive acoustic metrology for void detection (2018-06-05),

9. 9952041 - Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process (2018-04-24),

10. 9772183 - Flying sensor head (2017-09-26),

11. 9714825 - Wafer shape thickness and trench measurement (2017-07-25),

12. 9684052 - Method of measuring and assessing a probe card with an inspection device (2017-06-20),

13. 9664625 - Inspection of substrates using calibration and imaging (2017-05-30),

14. 9658169 - System and method of characterizing micro-fabrication processes (2017-05-23),

15. 9638782 - Probe card analysis system and method (2017-05-02),

Rudolph Technologies, Inc. is a leading provider of process characterization equipment and software for the semiconductor industry. They develop and deliver integrated solutions to enable complex semiconductor manufacturing processes, improve yield, and reduce costs. With their advanced inspection, metrology, and lithography technologies, Rudolph Technologies helps customers accelerate time to market for their products while ensuring the highest quality and reliability.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

114 Patents

#6 in Wilmington, MA

#181 in Massachusetts

#3,232 in US

#6,726 in the World

Wilmington, MA, United States of America

Rudolph Technologies, Inc.

Forward Citations = 536

143 inventors:

John Timothy Strom (12 out of 18 patents)

Mark Harless (10 out of 15 patents)

Cory Watkins (10 out of 19 patents)

4. Michael Kotelyanskii (9 out of 10 patents)

5. Christopher J Morath (8 out of 10 patents)

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