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For the Inventor, By the Inventor

Flanders, NJ, United States of America

Rudolph Technologies, Inc.


USPTO Granted Patents = 114

% Expired Patents = 17.5



Trademarks = 20

Forward Citations = 572

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136 inventors (with patents filed for the assignee):

goldMedal John Timothy Strom (12 out of 18 patents)

silverMedal Mark Harless (10 out of 15 patents)

bronzeMedal Cory Watkins (10 out of 19 patents)

4.  Michael Kotelyanskii (9 out of 10 patents)

5.  Christopher J Morath (8 out of 10 patents)

6.  Robert Gregory Wolf (7 out of 9 patents)

7.  Ajay Pai (7 out of 7 patents)

8.  Tuan D Le (7 out of 7 patents)

9.  Kevin Barr (6 out of 6 patents)

10.  Raymond Kraft (6 out of 11 patents)

11.  Troy Palm (6 out of 6 patents)

12.  Robin Mair (6 out of 11 patents)

13.  Priya Mukundhan (5 out of 8 patents)

14.  John Thornell (4 out of 4 patents)

15.  Chetan Suresh (4 out of 4 patents)


Core Competencies:
Wafer Edge Inspection
Defect Detection
Probe Card Analysis
Surface Acoustic Wave Metrology
Opto-Acoustic Metrology
Micro-Fabrication Processes
Calibration Techniques
Automated Inspection Systems
Focus Adjustment
Substrate Handling
3D Metrology
Ellipsometry

114 patents:

1. 10664714 - Substrate handling and identification mechanism (2020-05-26),
2. 10553504 - Inspection of substrates (2020-02-04),
3. 10466179 - Semiconductor device inspection of metallic discontinuities (2019-11-05),
4. 10412311 - Focus adjustment for surface part inspection (2019-09-10),
5. 10209300 - Opto-acoustic metrology of signal attenuating structures (2019-02-19),
6. 10173249 - Calibration of semiconductor metrology systems (2019-01-08),
7. 10024804 - System and method of characterizing micro-fabrication processes (2018-07-17),
8. 10014228 - Method and apparatus to assist the processing of deformed substrates (2018-07-03),
9. 9991176 - Non-destructive acoustic metrology for void detection (2018-06-05),
10. 9952041 - Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process (2018-04-24),
11. 9772183 - Flying sensor head (2017-09-26),
12. 9714825 - Wafer shape thickness and trench measurement (2017-07-25),
13. 9684052 - Method of measuring and assessing a probe card with an inspection device (2017-06-20),
14. 9664625 - Inspection of substrates using calibration and imaging (2017-05-30),
15. 9658169 - System and method of characterizing micro-fabrication processes (2017-05-23),
Rudolph Technologies, Inc. is a leading provider of process characterization equipment and software for the semiconductor industry. They develop and deliver integrated solutions to enable complex semiconductor manufacturing processes, improve yield, and reduce costs. With their advanced inspection, metrology, and lithography technologies, Rudolph Technologies helps customers accelerate time to market for their products while ensuring the highest quality and reliability.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 29 2026

Rudolph Technologies, Inc.
114 Patents

#1 in Flanders, NJ

#153 in New Jersey

#3,360 in US

#6,929 in the World

Flanders, NJ (US)
Flanders, NJ, United States of America

Rudolph Technologies, Inc.

Forward Citations = 572

136 inventors:

goldMedal John Timothy Strom (12 out of 18 patents)

silverMedal Mark Harless (10 out of 15 patents)

bronzeMedal Cory Watkins (10 out of 19 patents)

4.  Michael Kotelyanskii (9 out of 10 patents)

5.  Christopher J Morath (8 out of 10 patents)

Please report any incorrect information to [email protected]
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