The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Jan. 23, 2014
Applicant:
Rudolph Technologies, Inc., Flanders, NJ (US);
Inventors:
Rajiv Roy, Dallas, TX (US);
David Grant, Thousand Oaks, CA (US);
David S. Marx, Newbury Park, CA (US);
Hanh Chu, Edina, MN (US);
Assignee:
Rudolph Technologies, Inc., Wilmington, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/02 (2006.01); G01B 11/27 (2006.01); G01B 9/02 (2006.01); H01L 21/66 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G01B 11/272 (2013.01); G01B 9/0209 (2013.01); G01B 9/02044 (2013.01); G01N 21/95692 (2013.01); H01L 22/12 (2013.01); H01L 2224/16 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.