The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
Sep. 29, 2015
Manjusha Mehendale, Morristown, NJ (US);
Michael Kotelyanskii, Chatham, NJ (US);
Todd W. Murray, Golden, CO (US);
Robin Mair, West Chicago, IL (US);
Priya Mukundhan, Lake Hopatcong, NJ (US);
Jacob D. Dove, Boulder, CO (US);
Xueping RU, Flanders, NJ (US);
Jonathan Cohen, Flanders, NJ (US);
Timothy Kryman, Flanders, NJ (US);
Manjusha Mehendale, Morristown, NJ (US);
Michael Kotelyanskii, Chatham, NJ (US);
Todd W. Murray, Golden, CO (US);
Robin Mair, West Chicago, IL (US);
Priya Mukundhan, Lake Hopatcong, NJ (US);
Jacob D. Dove, Boulder, CO (US);
Xueping Ru, Flanders, NJ (US);
Jonathan Cohen, Flanders, NJ (US);
Timothy Kryman, Flanders, NJ (US);
Rudolph Technologies, Inc., Flanders, NJ (US);
The Regents of the University of Colorado, Denver, CO (US);
Abstract
Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring.