Timothy Kryman

Title: The Innovative Contributions of Timothy Kryman

Introduction

Timothy Kryman is a notable inventor based in Flanders, NJ (US). He has made significant contributions to the field of advanced interconnect technologies, particularly in the area of non-destructive acoustic metrology.

Latest Patents

Kryman holds a patent for "Non-destructive acoustic metrology for void detection." This innovative technology focuses on advanced interconnect technologies such as Through Silicon Vias (TSVs), which are essential for 3-D integration. The patent describes methods and systems that utilize laser-based acoustic techniques. A short laser pulse generates broadband acoustic waves that propagate within the TSV structure. An optical interferometer detects the surface displacement caused by these acoustic waves, which reflect within the structure and provide information about its dimensions and irregularities, such as voids. The technology identifies features of voids, including their location, based on the characteristics of the acoustic wave as it travels through the via. Measurements typically take only a few seconds per site and can be easily adopted for in-line process monitoring.

Career Highlights

Throughout his career, Kryman has worked with reputable organizations, including Rudolph Technologies, Inc. and the University of Colorado. His experience in these institutions has contributed to his expertise in the field of acoustic metrology and advanced interconnect technologies.

Collaborations

Kryman has collaborated with several professionals in his field, including Manjusha Mehendale and Michael Kotelyanskii. These collaborations have further enhanced his work and contributions to innovative technologies.

Conclusion

Timothy Kryman is a distinguished inventor whose work in non-destructive acoustic metrology has paved the way for advancements in 3-D integration technologies. His patent and career achievements reflect his commitment to innovation and excellence in the field.