For the Inventor, By the Inventor

Enter assignee name

St. Petersburg, FL, United States of America

Plasma-therm, Inc.

USPTO Granted Patents = 41

EPO Patents = 16

Trademarks = 12

Forward Citations = 235

Loading Chart...

Loading Chart...

39 inventors (with patents filed for the assignee):

Russell Westerman (34 out of 48 patents)

Linnell Martinez (28 out of 29 patents)

David Pays-Volard (27 out of 27 patents)

4. Gordon M Grivna (23 out of 220 patents)

5. Chris Johnson (23 out of 23 patents)

6. David J Johnson (23 out of 37 patents)

7. Rich Gauldin (8 out of 8 patents)

8. Dwarakanath Geerpuram (4 out of 4 patents)

9. Tsu-Wu Chiang (3 out of 3 patents)

10. Thierry Lazerand (3 out of 3 patents)

11. Leslie Michael Lea (2 out of 2 patents)

12. Peter Falvo (2 out of 2 patents)

13. Jason Michael Doub (2 out of 4 patents)

14. Ken Mackenzie (2 out of 3 patents)

15. Edmond A Richards (2 out of 2 patents)

Core Competencies:

Plasma Dicing

Semiconductor Wafer

Protective Coating

Ion Filter

Plasma Treatment

Die Attach Film

Metal Deposit Removal

Conductive Seal Ring

Electrostatic Chuck

Morphed Processing

Rotating Magnet Array

Sputter Source

41 patents: Sort by Forward Citations

1. 12489018 - Method and apparatus for plasma dicing a semi-conductor wafer (2025-12-02),

2. 11908741 - Protective coating for plasma dicing (2024-02-20),

3. 11747494 - Ion filter using aperture plate with plurality of zones (2023-09-05),

4. 11651999 - Method and apparatus for plasma dicing a semi-conductor wafer (2023-05-16),

5. 11587834 - Protective coating for plasma dicing (2023-02-21),

6. 11488865 - Method and apparatus for plasma dicing a semi-conductor wafer (2022-11-01),

7. 11075057 - Device for treating an object with plasma (2021-07-27),

8. 10943825 - Method for dicing die attach film (2021-03-09),

9. 10818552 - Method and apparatus for plasma dicing a semi-conductor wafer (2020-10-27),

10. 10767257 - Method for removing a metal deposit arranged on a surface in a chamber (2020-09-08),

11. 10741447 - Method and apparatus for plasma dicing a semi-conductor wafer (2020-08-11),

12. 10707060 - Method and apparatus for plasma dicing a semi-conductor wafer (2020-07-07),

13. 10573557 - Method and apparatus for plasma dicing a semi-conductor wafer (2020-02-25),

14. 10497621 - Method for dicing a substrate with back metal (2019-12-03),

15. 10297427 - Method and apparatus for plasma dicing a semi-conductor wafer (2019-05-21),

Plasma-Therm, Inc. is a leading global provider of advanced plasma processing equipment, offering innovative solutions for etching and deposition processes to various industries. With over 40 years of expertise, Plasma-Therm designs and manufactures highly reliable, high-performance plasma etch and deposition systems used in semiconductor, MEMS, nanotechnology, photonics, and other cutting-edge markets. The company is dedicated to delivering superior customer support and collaborative technical expertise to help customers achieve their process development and production goals.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

41 Patents

#7 in St. Petersburg, FL

#192 in Florida

#8,161 in US

#16,215 in the World

St. Petersburg, FL, United States of America

Plasma-therm, Inc.

Forward Citations = 235

39 inventors:

Russell Westerman (34 out of 48 patents)

Linnell Martinez (28 out of 29 patents)

David Pays-Volard (27 out of 27 patents)

4. Gordon M Grivna (23 out of 220 patents)

5. Chris Johnson (23 out of 23 patents)

Please report any incorrect information to support@idiyas.com

Loading…