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J-Devices Corporation

USPTO Granted Patents = 35

EPO Patents = 2

Forward Citations = 47

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53 inventors (with patents filed for the assignee):

Tomoshige Chikai (10 out of 10 patents)

Hiroaki Matsubara (9 out of 11 patents)

Shingo Nakamura (6 out of 13 patents)

4. Toshihiro Iwasaki (6 out of 24 patents)

5. Takeshi Miyakoshi (6 out of 6 patents)

6. Sumikazu Hosoyamada (6 out of 6 patents)

7. Yoshikazu Kumagaya (6 out of 6 patents)

8. Shotaro Sakumoto (6 out of 6 patents)

9. Kiminori Ishido (6 out of 8 patents)

10. Akio Katsumata (6 out of 16 patents)

11. Osamu Yamagata (5 out of 20 patents)

12. Shinji Watanabe (4 out of 124 patents)

13. Michiaki Tamakawa (4 out of 5 patents)

14. Shigenori Sawachi (4 out of 4 patents)

15. Hiroshi Inoue (4 out of 130 patents)

Core Competencies:

Semiconductor Package

Manufacturing Method

Interconnect Structure

Laser Processing

Magnetic Shielding

Heat Sink

Stacked Module

Non-Volatile Memory

Printed Circuit Board

Device Fabrication

Pickup Unit

Warping Reduction

35 patents: Sort by Forward Citations

1. 10559523 - Semiconductor package and a method for manufacturing a semiconductor device (2020-02-11),

2. 10553456 - Semiconductor package and manufacturing method of semiconductor package (2020-02-04),

3. 10529635 - Manufacturing method of semiconductor package including laser processing (2020-01-07),

4. 10388625 - Press fitting head and semiconductor manufacturing apparatus using the same (2019-08-20),

5. 10256196 - Semiconductor device and method for manufacturing same (2019-04-09),

6. 10236231 - Semiconductor device (2019-03-19),

7. 10224256 - Manufacturing method of semiconductor package (2019-03-05),

8. 10157760 - Semiconductor manufacturing apparatus having a pickup unit simultaneously picking up a plurality of semiconductor chips (2018-12-18),

9. 10134710 - Semiconductor package (2018-11-20),

10. 10096564 - Manufacturing method of semiconductor package (2018-10-09),

11. 10090276 - Semiconductor package to reduce warping (2018-10-02),

12. 10079161 - Method for producing a semiconductor package (2018-09-18),

13. 10062638 - Semiconductor package and a method for manufacturing a semiconductor device (2018-08-28),

14. 9922931 - Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structure (2018-03-20),

15. 9905536 - Semiconductor device (2018-02-27),

J-Devices Corporation is a prominent player in the semiconductor industry, specializing in the development and manufacturing of advanced packaging solutions for integrated circuits. The company focuses on innovative technologies that enhance the performance and reliability of electronic devices. With a strong presence in Usuki, Japan, J-Devices is committed to delivering high-quality products that meet the evolving needs of various sectors, including consumer electronics, automotive, and industrial applications. Their expertise in semiconductor packaging positions them as a key contributor to the advancement of modern electronics.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

J-Devices Corporation

35 Patents

#1 in Usuki

#2,128 in Japan

#19,148 in the World

J-Devices Corporation

Forward Citations = 47

53 inventors:

Tomoshige Chikai (10 out of 10 patents)

Hiroaki Matsubara (9 out of 11 patents)

Shingo Nakamura (6 out of 13 patents)

4. Toshihiro Iwasaki (6 out of 24 patents)

5. Takeshi Miyakoshi (6 out of 6 patents)

Please report any incorrect information to [email protected]

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