The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
May. 19, 2017
J-devices Corporation, Usuki, Oita, JP;
Minoru Kai, Nomi, JP;
J-DEVICES CORPORATION, Usuki, Oita, JP;
Abstract
A semiconductor manufacturing apparatus comprises a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips, a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator, a pickup unit connected to a movement control unit simultaneously picking up the plurality of semiconductor chips, and a control unit controlling movement and rotation of the pickup unit and controlling the suction control unit, the control unit is connected to the movement control unit. The pickup unit converts an interval of the plurality of semiconductor chips to a predetermined pitch and holds the pitch. The pickup unit moves the plurality of semiconductor chips from the stage to mounting positions of a supporting substrate and simultaneously adheres the plurality of semiconductor chips at the mounting positions by the control unit.