The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Apr. 21, 2017
Applicant:
J-devices Corporation, Usuki, Oita, JP;
Inventors:
Assignee:
J-Devices Corporation, Usuki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/82 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/56 (2013.01); H01L 21/82 (2013.01); H01L 23/544 (2013.01); H01L 24/17 (2013.01); H01L 2924/182 (2013.01);
Abstract
A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.