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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10236231 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Jun. 30, 2017

Semiconductor device

Applicant:

J-devices Corporation, Usuki, JP;

Inventors:

Takeshi Miyakoshi, Yokohama, JP;

Sumikazu Hosoyamada, Yokohama, JP;

Yoshikazu Kumagaya, Yokohama, JP;

Tomoshige Chikai, Yokohama, JP;

Shingo Nakamura, Yokohama, JP;

Hiroaki Matsubara, Yokohama, JP;

Shotaro Sakumoto, Yokohama, JP;

Assignee:

J-DEVICES CORPORATION, Usuki, JP;

Attorney:
Primary Examiner:

Galina G Yushina

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 23/3107 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49524 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 24/17 (2013.01); H01L 24/36 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 21/565 (2013.01); H01L 23/49548 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.

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