Sumikazu Hosoyamada

Title: Sumikazu Hosoyamada: Innovator in Semiconductor Technology

Introduction

Sumikazu Hosoyamada is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His innovative designs and solutions have advanced the capabilities of semiconductor devices and packages.

Latest Patents

Among his latest patents, one notable invention is a semiconductor device that includes a lead frame, a circuit board located on the lead frame, and a power device mounted on the circuit board via a bump. This design also features a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board and can include various elements such as capacitors, resistors, inductors, diodes, and switching elements. Another significant patent is for a stacked semiconductor package, which consists of a first semiconductor package with a first circuit board and a first semiconductor element, along with a second semiconductor package stacked on top. This package includes a sealing resin, a conductive layer, and a thermal via connected to the conductive layer.

Career Highlights

Sumikazu Hosoyamada has built a successful career at J-Devices Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in developing advanced semiconductor solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Sumikazu has collaborated with talented individuals such as Hiroaki Matsubara and Tomoshige Chikai. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Sumikazu Hosoyamada's contributions to semiconductor technology through his patents and work at J-Devices Corporation highlight his role as a key innovator in the field. His inventions continue to shape the future of electronics and semiconductor applications.