The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jun. 19, 2015
J-devices Corporation, Oita, JP;
Hirokazu Honda, Kanagawa, JP;
Shinji Watanabe, Kanagawa, JP;
Toshihiro Iwasaki, Kanagawa, JP;
Kiminori Ishido, Kanagawa, JP;
Koichiro Niwa, Kanagawa, JP;
Takeshi Miyakoshi, Kanagawa, JP;
Sumikazu Hosoyamada, Kanagawa, JP;
Yoshikazu Kumagaya, Kanagawa, JP;
Tomoshige Chikai, Kanagawa, JP;
Shingo Nakamura, Kanagawa, JP;
Shotaro Sakumoto, Kanagawa, JP;
Hiroaki Matsubara, Kanagawa, JP;
J-DEVICES CORPORATION, Oita, JP;
Abstract
A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.