The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Jul. 20, 2015
J-devices Corporation, Oita, JP;
Shinji Watanabe, Kanagawa, JP;
Sumikazu Hosoyamada, Kanagawa, JP;
Shingo Nakamura, Kanagawa, JP;
Hiroshi Demachi, Kanagawa, JP;
Takeshi Miyakoshi, Kanagawa, JP;
Tomoshige Chikai, Kanagawa, JP;
Kiminori Ishido, Kanagawa, JP;
Hiroaki Matsubara, Kanagawa, JP;
Takashi Nakamura, Kanagawa, JP;
Hirokazu Honda, Kanagawa, JP;
Yoshikazu Kumagaya, Kanagawa, JP;
Shotaro Sakumoto, Kanagawa, JP;
Toshihiro Iwasaki, Kanagawa, JP;
Michiaki Tamakawa, Kanagawa, JP;
J-DEVICES CORPORATION, Oita, JP;
Abstract
A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.