The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Feb. 02, 2017
J-devices Corporation, Oita, JP;
Takeshi Miyakoshi, Kanagawa, JP;
Sumikazu Hosoyamada, Kanagawa, JP;
Yoshikazu Kumagaya, Kanagawa, JP;
Tomoshige Chikai, Kanagawa, JP;
Shingo Nakamura, Kanagawa, JP;
Hiroaki Matsubara, Kanagawa, JP;
Shotaro Sakumoto, Kanagawa, JP;
J-DEVICES CORPORATION, Oita, JP;
Abstract
A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.