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For the Inventor, By the Inventor

Wuhan, China

Zi Qun Hua

This inventor holds 16 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Yangtze Memory Technologies Co., Ltd.. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zi Qun Hua. Retrieved from https://idiyas.com/inventor/zi-qun-hua

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.2

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Hubei, CN (2020 - 2022)
  • Wuhan, CN (2019 - 2024)

Company Filing History:

goldMedal16 out of 1,190 
 
Yangtze Memory Technologies Co., Ltd.
 patents

Years Active: 2019-2025

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16 patents (USPTO):Explore Patents
1. 12347684 - Method and structure for cutting dense line patterns using self-aligned double patterning (2025-07-01),
2. 12074105 - Self-aligned contacts in three-dimensional memory devices and methods for forming the same (2024-08-27),
3. 11710730 - Fabricating method of semiconductor device with exposed input/output pad in recess (2023-07-25),
4. 11664309 - Self-aligned contacts in three-dimensional memory devices and methods for forming the same (2023-05-30),
5. 11552012 - Self-aligned contacts in three-dimensional memory devices and methods for forming the same (2023-01-10),
6. 11462503 - Hybrid bonding using dummy bonding contacts (2022-10-04),
7. 11430775 - Semiconductor device with exposed input/output pad in recess (2022-08-30),
8. 11430756 - Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same (2022-08-30),
9. 11251043 - Method and structure for cutting dense line patterns using self-aligned double patterning (2022-02-15),
10. 11205619 - Hybrid bonding using dummy bonding contacts and dummy interconnects (2021-12-21),
11. 11049834 - Hybrid bonding using dummy bonding contacts (2021-06-29),
12. 10840125 - Memory structure and method for forming the same (2020-11-17),
13. 10784225 - Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same (2020-09-22),
14. 10748851 - Hybrid bonding using dummy bonding contacts and dummy interconnects (2020-08-18),
15. 10727056 - Method and structure for cutting dense line patterns using self-aligned double patterning (2020-07-28),

Title: Inventor Zi Qun Hua - Revolutionizing Technology in Wuhan

Introduction: Zi Qun Hua is a pioneering inventor based in Wuhan, China, known for her groundbreaking contributions to the field of technology.

Latest Patents: Zi Qun Hua holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing her diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Zi Qun Hua has worked with leading research institutions and universities to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout her career, Zi Qun Hua has collaborated with top companies, innovative startups, and talented individuals to bring her inventions to life and make a difference in the world of technology.

Conclusion: Zi Qun Hua's passion for innovation and her relentless drive to push the boundaries of what is possible make her a true trailblazer in the field of technology, inspiring the next generation of inventors to dream big and create change.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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