The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Oct. 08, 2019
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventors:

He Chen, Wuhan, CN;

Zi Qun Hua, Wuhan, CN;

Shu Wu, Wuhan, CN;

Yong Qing Wang, Wuhan, CN;

Liang Xiao, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 21/683 (2006.01); H01L 23/528 (2006.01); H01L 27/11526 (2017.01); H01L 27/11556 (2017.01); H01L 27/11573 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/6835 (2013.01); H01L 23/5283 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 27/11526 (2013.01); H01L 27/11556 (2013.01); H01L 27/11573 (2013.01); H01L 27/11582 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/08147 (2013.01);
Abstract

A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a semiconductor structure and an input/output pad. The semiconductor structure includes a first substrate and a conductive layer, in which the first substrate has a first surface and a second surface opposite to each other, the conductive layer is disposed on the first surface of the first substrate, and the conductive layer includes one or more first trace. The first semiconductor structure has a recess penetrating the first substrate and exposing the one or more first trace, and the input/output pad is disposed on the one or more first trace and in the recess.


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