Nantong, China

Yujuan Tao

This inventor holds 16 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging. Top assignees: Nantong Fujitsu Microelectronics Co., Ltd., Tongfu Microelectronics Co., Ltd., Nantong Tongfu Microelectronics Co., Ltd. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yujuan Tao. Retrieved from https://idiyas.com/inventor/yujuan-tao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 10(Granted Patents)


Location History:

  • Jiangsu, CN (2014 - 2017)
  • Nantong, CN (2015 - 2020)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Chips
Encapsulation Layers
3D Packaging
Fan-Out Methods
Fabrication Techniques
System-Level Packaging
Metal Contacts
High-Density Packaging
Chip Packaging
Packaging Structures
16 patents (USPTO):Explore Patents

Title: Yujuan Tao: Innovator in Semiconductor Packaging

Introduction

Yujuan Tao is a prominent inventor based in Nantong, China, known for his significant contributions to semiconductor packaging technology. With a total of 15 patents to his name, he has made remarkable advancements in the field, particularly in the design and fabrication of packaging structures.

Latest Patents

Yujuan Tao's latest patents include innovative methods for packaging structures. One notable patent is the "Packaging structure and fabrication method thereof," which outlines a comprehensive process involving semiconductor chips, soldering pads, and encapsulation layers. This method enhances the efficiency and reliability of semiconductor packaging. Another significant patent is the "System-level packaging structures," which describes a method for creating a packaging substrate with multiple package layers, improving the overall functionality and integration of semiconductor devices.

Career Highlights

Throughout his career, Yujuan Tao has worked with leading companies in the semiconductor industry, including Nantong Fujitsu Microelectronics Co., Ltd. and Tongfu Microelectronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Yujuan Tao has collaborated with notable professionals in the field, including Lei Shi and Guohua Gao. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in semiconductor packaging.

Conclusion

Yujuan Tao's contributions to semiconductor packaging technology have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to influence the future of semiconductor design and fabrication.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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