Method for forming package structure

Abstract

A method for forming a package structure is provided, which includes: providing a pre-packaged panel including a first encapsulation layer, which includes multiple integrating units each including at least one semiconductor chip with multiple first pads, and first metal bumps are disposed on the first pads; providing a circuit board including a first surface and a second surface, where the circuit board includes multiple carrying units each including multiple input pads on the first surface and multiple output pads on the second surface; mounting the pre-packaged panel on the first surface to form multiple package units; forming a filling layer by filling a space between the first surface and the pre-packaged panel; forming second metal bumps on the output pads on the second surface; cutting the structure based on the multiple package units to form multiple independent package structures. Accordingly, the package structure improves package efficiency.