The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Sep. 17, 2014
Nantong Fujitsu Microelectronics Co., Ltd., Jiangsu, CN;
Yujuan Tao, Jiangsu, CN;
Nantong Fujitsu Microelectronics Co., Ltd., Nantong, Jiangsu, CN;
Abstract
A package structure, including: a circuit board, including a first surface and a second surface opposite to the first surface, where the circuit board possesses multiple carrying units arranged in a matrix form, each of which possesses multiple input pads on the first surface and multiple output pads on the second surface, where the input pads and the output pads are interconnected electrically; a pre-packaged panel, including a first encapsulation layer, which possesses multiple integrating units arranged in a matrix form, wherein each of the integrating units possesses at least one semiconductor chip with multiple first pads, where first metal bumps are disposed on the first pads; wherein the pre-packaged panel is mounted on the first surface; a filling layer, filling a space between the first surface and the pre-packaged panel; and second metal bumps, disposed on the output pads. Accordingly, the package structure improves package efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile