Fan-out high-density packaging methods and structures

Abstract

A fan-out high-density packaging method includes providing a packaging substrate, forming a stripping film on the packaging substrate, and forming a first protection layer on the stripping film and pre-designed photolithography pattern openings on the first protection layer. The method also includes forming a metal redistribution layer on the surface of the first protection layer and in the photolithography pattern openings, forming a second protection layer on the first protection layer and partially exposing the metal redistribution layer, and forming at least one package layer on the second protection layer. Each of at least one package layer includes a straight mounting layer, a sealant layer, and a wiring layer formed in sequence, and the package layer connects the metal redistribution layer through the wiring layer. Further, the method includes forming at least one top-level package layer on top of the at least one package layer, removing the packaging substrate and the stripping film to expose the metal redistribution layer in the first protection layer, and planting metal solder balls on the exposed metal redistribution layer.