Nantong, China

Lei Shi

This inventor holds 36 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Tongfu Microelectronics Co., Ltd., Nantong Fujitsu Microelectronics Co., Ltd., Littelfuse Semiconductor (Wuxi) Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lei Shi. Retrieved from https://idiyas.com/inventor/lei-shi-t7ao3d28

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 36 

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Wuxi, CN (2021)
  • Jiangsu, CN (2014 - 2023)
  • Nantong, CN (2015 - 2023)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Chips
Packaging Structure
3D Packaging
Fabrication Method
Testing Fixture
Thermal Cutoff
Surge Protection
Integrated Chip
Fan-Out Packaging
Flip-Chip Method
Transient Voltage Suppression
Metal Contact
36 patents (USPTO):Explore Patents

Title: Lei Shi: Innovator in Semiconductor Technology

Introduction

Lei Shi, a prominent inventor based in Nantong, China, has made significant contributions to the field of semiconductor technology with an impressive portfolio of 35 patents. His work encompasses innovative designs and packaging solutions that enhance the functionality and reliability of electronic devices.

Latest Patents

Lei Shi's latest patents highlight his cutting-edge advancements in semiconductor devices. One notable invention is the "Integrated Mult-Device Chip and Package," which describes a protection device that includes a semiconductor substrate with a thyristor-type device integrated within. This device operates effectively by connecting a first and second PN diode through the thyristor, providing enhanced protection in electronic circuits.

Another important patent is the "Packaging Structure and Fabrication Method Thereof," which outlines a comprehensive method for creating advanced packaging for semiconductor chips. This method involves adhering functional surfaces of semiconductor chips to a carrier plate, applying shielding layers, and incorporating electronic devices without shielding. The innovative approach ensures robust protection and functionality for semiconductor devices, which are critical in modern electronics.

Career Highlights

Throughout his career, Lei Shi has worked with leading companies in the semiconductor industry, including Tongfu Microelectronics Co., Ltd. and Nantong Fujitsu Microelectronics Co., Ltd. His contributions to these organizations have helped propel advancements in semiconductor technology and establish new benchmarks in product development.

Collaborations

Lei Shi has collaborated with notable professionals in his field, such as Yujuan Tao and Chang-Ming Lin. These collaborations have fostered an environment of innovation and have been instrumental in the successful development of various semiconductor solutions.

Conclusion

With 35 patents to his name, Lei Shi continues to be a driving force in the semiconductor technology landscape. His innovative inventions and collaborations with esteemed professionals underscore his commitment to advancing technology and delivering effective solutions for the electronic industry. As he progresses in his career, his contributions will undoubtedly leave a lasting impact on the field of semiconductors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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