The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Nov. 28, 2016
Applicant:
Tongfu Microelectronics Co., Ltd., Nantong, CN;
Inventors:
Assignee:
TONGFU MICROELECTRONICS CO., LTD., Nantong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/563 (2013.01); H01L 23/49816 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24151 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48149 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.