Honghui Wang

Title: Innovator in Semiconductor Packaging - Honghui Wang

Introduction

Honghui Wang is a prominent inventor based in Nantong, China, with a remarkable portfolio comprising six patents. His contributions have significantly advanced the field of semiconductor packaging, showcasing his expertise and innovation.

Latest Patents

Among his latest inventions is a *packaging structure of semiconductor chips and formation method thereof*. This cutting-edge method includes several innovative steps, such as providing semiconductor chips with soldering pads and metal bumps, along with a base plate, wiring structures, input terminals, and output terminals. The process incorporates techniques to form a bottom filling layer between the chips and the base, as well as multiple shielding layers and a plastic encapsulation layer, concluding with the formation of external contact structures.

Additionally, Honghui Wang has developed a *system-level packaging method* which focuses on a packaging substrate designed with a first functional surface and a second surface for wiring arrangements. This method involves the creation of at least two package layers on the first functional surface, enhancing the efficiency and functionality of semiconductor packaging.

Career Highlights

Throughout his career, Honghui Wang has worked with notable companies such as Nantong Fujitsu Microelectronics Co., Ltd. and Tongfu Microelectronics Co., Ltd. His experience within these organizations has played a crucial role in the development and refinement of his patented technologies, further establishing him as a key player in the semiconductor industry.

Collaborations

In his professional journey, Honghui Wang has collaborated with talented individuals like Lei Shi and Yujuan Tao. These partnerships have facilitated knowledge exchange and innovation, contributing to the success of his projects and patents.

Conclusion

Honghui Wang's innovative spirit and dedication to advancing semiconductor packaging technologies are evident through his six patents. As he continues to push boundaries in his field, he serves as an inspiration for future inventors and researchers aiming to make impactful contributions to technology.