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Tongfu Microelectronics Co., Ltd.

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USPTO Granted Patents = 29

Forward Citations = 23

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12 inventors (with patents filed for the assignee):

Lei Shi (17 out of 36 patents)

Guoqing Yu (5 out of 5 patents)

Yujuan Tao (3 out of 16 patents)

4. Honghui Wang (3 out of 6 patents)

5. Guohua Gao (2 out of 7 patents)

6. Chang-Ming Lin (2 out of 8 patents)

7. Jing Wu (1 out of 24 patents)

8. Wanchun Ding (1 out of 2 patents)

9. Haizhong Shi (1 out of 1 patent)

10. Guo-Hua Gao (1 out of 1 patent)

11. Yu-Juan Tao (1 out of 3 patents)

12. Xiaoyong Miao (1 out of 1 patent)

Core Competencies:

Packaging Structure

Semiconductor Chip

3D Packaging

Wafer-Level Packaging

Testing Fixture

Fabrication Method

System-Level Packaging

Chip Substrate

Improvement Layer

Formation Method

Semiconductor Device

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29 patents: Sort by Forward Citations

1. 12438098 - Packaging structure and fabrication method thereof (2025-10-07),

2. 12205828 - Packaging structure and fabrication method thereof (2025-01-21),

3. 12119308 - Packaging structure of semiconductor chip and formation method thereof (2024-10-15),

4. 12074183 - Semiconductor packaging method and semiconductor package device (2024-08-27),

5. 11990432 - Semiconductor packaging method and semiconductor package device (2024-05-21),

6. 11990398 - Semiconductor package device having chip substrate with pads around photosensitive region (2024-05-21),

7. 11948960 - Semiconductor packaging method and semiconductor package device (2024-04-02),

8. 11948911 - Semiconductor packaging method and semiconductor package device (2024-04-02),

9. 11791310 - Semiconductor packaging structure (2023-10-17),

10. 11670571 - Semiconductor chip package device (2023-06-06),

11. 11430706 - Packaging structure (2022-08-30),

12. 11139267 - Packaging structure and forming method thereof (2021-10-05),

13. 11127661 - Semiconductor chip package method and semiconductor chip package device (2021-09-21),

14. 10998289 - Packaging structure and forming method thereof (2021-05-04),

15. 10937745 - Semiconductor chip package array (2021-03-02),

Company Overview

Tongfu Microelectronics Co., Ltd. is a prominent player in the semiconductor industry, specializing in the development and manufacturing of advanced packaging solutions for integrated circuits. The company focuses on innovative technologies that enhance the performance and reliability of electronic components. With a strong emphasis on research and development, Tongfu Microelectronics serves a diverse range of sectors, including consumer electronics, telecommunications, and automotive industries, contributing to the evolution of modern electronic systems.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

29 Patents

#2 in Nantong

#1,056 in China

#22,581 in the World

Tongfu Microelectronics Co., Ltd.

Forward Citations = 23

12 inventors:

Lei Shi (17 out of 36 patents)

Guoqing Yu (5 out of 5 patents)

Yujuan Tao (3 out of 16 patents)

4. Honghui Wang (3 out of 6 patents)

5. Guohua Gao (2 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tongfu Microelectronics Co., Ltd.. Retrieved from https://idiyas.com/company/tongfu-microelectronics-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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