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Tongfu Microelectronics Co., Ltd.

USPTO Granted Patents = 29

Forward Citations = 22

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12 inventors (with patents filed for the assignee):

Lei Shi (17 out of 35 patents)

Guoqing Yu (5 out of 5 patents)

Yujuan Tao (3 out of 15 patents)

4. Honghui Wang (3 out of 6 patents)

5. Guohua Gao (2 out of 7 patents)

6. Chang-Ming Lin (2 out of 8 patents)

7. Jing Wu (1 out of 23 patents)

8. Wanchun Ding (1 out of 2 patents)

9. Haizhong Shi (1 out of 1 patent)

10. Guo-Hua Gao (1 out of 1 patent)

11. Yu-Juan Tao (1 out of 3 patents)

12. Xiaoyong Miao (1 out of 1 patent)

29 patents: Sort by Forward Citations

1. 12438098 - Packaging structure and fabrication method thereof (2025-10-07),

2. 12205828 - Packaging structure and fabrication method thereof (2025-01-21),

3. 12119308 - Packaging structure of semiconductor chip and formation method thereof (2024-10-15),

4. 12074183 - Semiconductor packaging method and semiconductor package device (2024-08-27),

5. 11990432 - Semiconductor packaging method and semiconductor package device (2024-05-21),

6. 11990398 - Semiconductor package device having chip substrate with pads around photosensitive region (2024-05-21),

7. 11948960 - Semiconductor packaging method and semiconductor package device (2024-04-02),

8. 11948911 - Semiconductor packaging method and semiconductor package device (2024-04-02),

9. 11791310 - Semiconductor packaging structure (2023-10-17),

10. 11670571 - Semiconductor chip package device (2023-06-06),

11. 11430706 - Packaging structure (2022-08-30),

12. 11139267 - Packaging structure and forming method thereof (2021-10-05),

13. 11127661 - Semiconductor chip package method and semiconductor chip package device (2021-09-21),

14. 10998289 - Packaging structure and forming method thereof (2021-05-04),

15. 10937745 - Semiconductor chip package array (2021-03-02),

TONGFU MICROELECTRONICS CO., LTD. is a leading manufacturer and supplier of microelectronic products. With years of experience and a dedicated team, we specialize in designing and producing high-quality semiconductor devices for various industries. Our products are known for their reliability, efficiency, and superior performance. Visit our website to learn more about our company and explore our range of innovative microelectronic solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

29 Patents

#1 in Nantong

#941 in China

#21,885 in the World

Tongfu Microelectronics Co., Ltd.

Forward Citations = 22

12 inventors:

Lei Shi (17 out of 35 patents)

Guoqing Yu (5 out of 5 patents)

Yujuan Tao (3 out of 15 patents)

4. Honghui Wang (3 out of 6 patents)

5. Guohua Gao (2 out of 7 patents)

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