The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
May. 11, 2021
Tongfu Microelectronics Co., Ltd., Nantong, CN;
Guoqing Yu, Nantong, CN;
TONGFU MICROELECTRONICS CO., LTD., Nantong, CN;
Abstract
A semiconductor packaging method and a semiconductor package device are provided. The packaging method includes providing a chip. The chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; pads disposed at the front surface of the chip substrate and around the photosensitive region; and a transparent protection layer over the front surface of the chip substrate, where the transparent protection layer covers the photosensitive region and the pad. The packaging method also includes forming through-holes in the chip substrate at positions corresponding to the pads from the back surface of the chip substrate, where the pads one-to-one correspond to the through-holes and are exposed from the through-holes. Further, the packaging method includes electrically connecting each pad of the chip to a circuit board through a metal rewiring layer in a corresponding through-hole.