Nantong, China

Guoqing Yu

This inventor holds 5 USPTO granted patents. Top assignee: Tongfu Microelectronics Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Guoqing Yu. Retrieved from https://idiyas.com/inventor/guoqing-yu-mw0lzdmq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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% Patents Active = 100.0

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2024

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5 patents (USPTO):Explore Patents

Title: Innovative Contributions of Guoqing Yu in Semiconductor Technology

Introduction

Guoqing Yu is a notable inventor based in Nantong, China, recognized for his significant contributions to the field of semiconductor packaging. With a total of five patents to his name, his work focuses on enhancing the efficiency and functionality of semiconductor devices. His latest inventions demonstrate an innovative approach to semiconductor packaging methods, which play a crucial role in modern electronics.

Latest Patents

Guoqing Yu's recent patents involve a semiconductor packaging method and a semiconductor package device. The disclosed method includes providing a chip that features a chip substrate with both front and back surfaces, soldering pads disposed on the front surface surrounding a photosensitive region, and a metal component that is strategically placed on the sides of each soldering pad. A unique aspect of Yu's invention is the inclusion of a transparent protective layer that covers the chip substrate's front surface, while also allowing for certain parts of the metal component to remain exposed for effective electrical connections to circuit boards. These innovations aim to improve the durability and functionality of semiconductor devices.

Career Highlights

Guoqing Yu works with Tongfu Microelectronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His role at the company has enabled him to apply his inventive skills and contribute to advancements in microelectronics, particularly in packaging solutions that facilitate enhanced device performance. His dedication to developing pioneering technologies has positioned him as an influential figure in the industry.

Collaborations

Throughout his career, Guoqing Yu has likely collaborated with various industry experts, researchers, and engineers at Tongfu Microelectronics Co., Ltd. These partnerships foster an environment of innovation, allowing for the exchange of ideas and strategies that lead to successful patent applications and groundbreaking inventions in semiconductor packaging.

Conclusion

In summary, Guoqing Yu's contributions to semiconductor technology and his recent patents highlight the importance of innovation in electronics. His work not only exemplifies the capabilities of advanced semiconductor packaging methods but also sets the stage for future developments in this vital field. As technology continues to evolve, the impact of inventors like Guoqing Yu will undoubtedly be felt across various industries worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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