The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Jul. 17, 2020
Nantong Tongfu Microelectronics Co., Ltd, Nantong, CN;
Tongfu Microelectronics Co., Ltd., Nantong, CN;
Lei Shi, Nantong, CN;
NANTONG TONGFU MICROELECTRONICS CO., LTD, Nantong, CN;
TONGFU MICROELECTRONICS CO., LTD., Nantong, CN;
Abstract
A packaging structure and fabrication method thereof are provided. The method includes: providing semiconductor chips including functional surfaces, non-functional surfaces, and first soldering pads; providing electronic devices that do not need shielding including second soldering pads; providing a carrier plate; adhering functional surfaces of the semiconductor chips to the carrier plate; forming a first shielding layer covering non-functional surfaces and sidewalls of the semiconductor chips; adhering each electronic device to the carrier plate at a side of a corresponding semiconductor chip; forming a second shielding layer on the first shielding layer; forming a plastic encapsulation layer covering the second shielding layer, the electronic devices that do not need shielding, and the carrier plate; peeling off the carrier plate to form a pre-packaging plate; and forming first external contact structures connected to the first soldering pads and second external contact structures connected to the second soldering pads.