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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11791310 B1

PDFFull Text
Date of Patent:
Oct. 17, 2023

Filed:

Aug. 27, 2021

Semiconductor packaging structure

Applicant:

Tongfu Microelectronics Co., Ltd., Nantong, CN;

Inventor:

Lei Shi, Nantong, CN;

Assignee:

TONGFU MICROELECTRONICS CO., LTD., Nantong, CN;

Attorney:

ANOVA LAW GROUP PLLC

Primary Examiner:

S M Sohel Imtiaz

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/067 (2013.01); H01L 2924/0695 (2013.01); H01L 2924/07025 (2013.01);
Abstract

Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.

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Quick Actions:

Shi, Lei. (2023). Semiconductor packaging structure (U.S. Patent No. 11791310). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11791310

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