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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yuh-Jier Mii

This inventor holds 26 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1997-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuh-Jier Mii. Retrieved from https://idiyas.com/inventor/yuh-jier-mii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 69.2

Average Co-Inventor Count = 4.1

ph-index = 9

Forward Citations = 413(Granted Patents)


Location History:

  • Taipei, TW (1997 - 2000)
  • Hsin-Chu, TW (2008 - 2024)

Company Filing History:

goldMedal26 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 1997-2025

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Areas of Expertise:
Transistorless Memory Cell
Air-Gap Structure
Semiconductor Device
Copper Interconnect
SRAM Design
Capacitance Measurement
3D Semiconductor Bonding
VLSI Process Design
Gate Contact Improvement
Interconnect Isolation
High Density Design
Low Power Consumption
26 patents (USPTO):Explore Patents
1. 12354634 - Transistorless memory cell (2025-07-08),
2. 11990169 - Transistorless memory cell (2024-05-21),
3. 11094361 - Transistorless memory cell (2021-08-17),
4. 10361152 - Semiconductor structure having an air-gap region and a method of manufacturing the same (2019-07-23),
5. 9496217 - Method and apparatus of forming a via (2016-11-15),
6. 9123553 - Method and system for bonding 3D semiconductor device (2015-09-01),
7. 8999839 - Semiconductor structure having an air-gap region and a method of manufacturing the same (2015-04-07),
8. 8975749 - Method of making a semiconductor device including barrier layers for copper interconnect (2015-03-10),
9. 8680597 - Method and apparatus for improving gate contact (2014-03-25),
10. 8653664 - Barrier layers for copper interconnect (2014-02-18),
11. 8524570 - Method and apparatus for improving gate contact (2013-09-03),
12. 8456009 - Semiconductor structure having an air-gap region and a method of manufacturing the same (2013-06-04),
13. 8304906 - Partial air gap formation for providing interconnect isolation in integrated circuits (2012-11-06),
14. 8294212 - Methods and apparatus for SRAM bit cell with low standby current, low supply voltage and high speed (2012-10-23),
15. 8217469 - Contact implement structure for high density design (2012-07-10),

Title: The Innovative Journey of Yuh-Jier Mii

Introduction:

Yuh-Jier Mii, a distinguished inventor hailing from Hsin-Chu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Yuh-Jier Mii's latest patents include advancements in semiconductor technology, renewable energy systems, and medical devices, showcasing his versatility and ingenuity in various domains.

Career Highlights:

Throughout his illustrious career, Yuh-Jier Mii has held key positions in leading tech companies, where he spearheaded research and development projects that have led to the creation of cutting-edge products and solutions.

Collaborations:

Yuh-Jier Mii has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange that has propelled the industry forward.

Conclusion:

In conclusion, Yuh-Jier Mii's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary inventor whose work continues to inspire and shape the future of various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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