The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Jun. 04, 2009
Hsin-yi Tsai, Hsinchu, TW;
Chih-hao Chen, Hsinchu, TW;
Ming-chung Liang, Hsinchu, TW;
Chii-ping Chen, Taichung, TW;
Lai Chien Wen, Hsinchu, TW;
Yuh-jier Mii, Hsin Chu, TW;
Hsin-Yi Tsai, Hsinchu, TW;
Chih-Hao Chen, Hsinchu, TW;
Ming-Chung Liang, Hsinchu, TW;
Chii-Ping Chen, Taichung, TW;
Lai Chien Wen, Hsinchu, TW;
Yuh-Jier Mii, Hsin Chu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;
Abstract
The present disclosure provides a semiconductor device that includes, a substrate; a first conductive line located over the substrate and extending along a first axis, the first conductive line having a first length and a first width, the first length being measured along the first axis; a second conductive line located over the first conductive line and extending along a second axis different from the first axis, the second conductive line having a second length and a second width, the second length being measured along the second axis; and a via coupling the first and second conductive lines, the via having an upper surface that contacts the second conductive line and a lower surface that contacts the first conductive line. The via has an approximately straight edge at the upper surface, the straight edge extending along the second axis and being substantially aligned with the second conductive line.