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For the Inventor, By the Inventor

Taichung, Taiwan

Chii-Ping Chen

This inventor holds 47 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Devices. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chii-Ping Chen. Retrieved from https://idiyas.com/inventor/chii-ping-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 91.5

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 83(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (2005)
  • Taichung, TW (2012 - 2017)
  • Hsinchu, TW (2004 - 2024)

Company Filing History:

goldMedal46 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2004-2026

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Areas of Expertise:
Semiconductor Devices
Thermal Dissipation
Resistive Elements
Interconnect Structures
Diffusion Barrier
Low Capacitance
Integrated Circuits
Self-Aligned Scheme
Conductive Via
Mask Treatment
Patterning
Manufacturing Methods
47 patents (USPTO):Explore Patents
1. 12713893 - CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (2026-08-18),
2. 12660582 - Self-aligned interconnect structure and method of forming the same (2026-06-16),
3. 12550721 - Inter-wire cavity for low capacitance (2026-02-10),
4. 12543566 - Semiconductor devices and method for forming the same (2026-02-03),
5. 12512363 - Forming interconnect structures in semiconductor devices (2025-12-30),
6. 12476146 - Self-aligned scheme for semiconductor device and method of forming the same (2025-11-18),
7. 12451401 - Thermal dissipation in semiconductor devices (2025-10-21),
8. 12387977 - Self-aligned scheme for semiconductor device and method of forming the same (2025-08-12),
9. 12368103 - Diffusion barrier layer for conductive via to decrease contact resistance (2025-07-22),
10. 12362235 - Barrier free interface between BEOL interconnects (2025-07-15),
11. 12341101 - Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer (2025-06-24),
12. 12165947 - Semiconductor devices and method for forming the same (2024-12-10),
13. 12119262 - Semiconductor device structure with resistive element (2024-10-15),
14. 12040178 - Method for manufacturing semiconductor structure with resistive elements (2024-07-16),
15. 11942390 - Thermal dissipation in semiconductor devices (2024-03-26),

Title: The Innovative Journey of Chii-Ping Chen

Introduction: Chii-Ping Chen, a distinguished inventor hailing from Taichung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Chii-Ping Chen's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, a sustainable energy solution utilizing solar power, and a smart home automation system for enhanced convenience.

Career Highlights: With a career spanning over two decades, Chii-Ping Chen has established himself as a visionary inventor. He has worked with renowned tech companies, leading research institutions, and universities to bring his innovative ideas to life.

Collaborations: Throughout his career, Chii-Ping Chen has collaborated with top engineers, scientists, and designers to develop cutting-edge technologies. His collaborative efforts have resulted in the creation of groundbreaking products that have impacted various industries.

Conclusion: Chii-Ping Chen's passion for innovation and dedication to pushing the boundaries of technology have solidified his reputation as a pioneering inventor in the global tech community. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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