Company Filing History:

38 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 9,138

Industrial Technology Research Institute

patents

1 out of 1

Semiconductor Manufacturing Company

patent

Years Active: 1995-2009

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41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7482278 - Key-hole free process for high aspect ratio gap filling with reentrant spacer (2009-01-27),

2. 7160811 - Laminated silicate glass layer etch stop method for fabricating microelectronic product (2007-01-09),

3. 7056821 - Method for manufacturing dual damascene structure with a trench formed first (2006-06-06),

4. 7015129 - Bond pad scheme for Cu process (2006-03-21),

5. 6956254 - Multilayered dual bit memory device with improved write/erase characteristics and method of manufacturing (2005-10-18),

6. 6844626 - Bond pad scheme for Cu process (2005-01-18),

7. 6600228 - Keyhole at the top metal level prefilled with photoresist to prevent passivation damage even for a severe top metal rule (2003-07-29),

8. 6586162 - Simple photo development step to form TiSix gate in DRAM process (2003-07-01),

9. 6555435 - Method to eliminate shorts between adjacent contacts due to interlevel dielectric voids (2003-04-29),

10. 6436763 - Process for making embedded DRAM circuits having capacitor under bit-line (CUB) (2002-08-20),

11. 6403416 - Method for making a double-cylinder-capacitor structure for dynamic random access memory (DRAM) (2002-06-11),

12. 6365464 - Method to eliminate shorts between adjacent contacts due to interlevel dielectric voids (2002-04-02),

13. 6323118 - Borderless dual damascene contact (2001-11-27),

14. 6294456 - Method of prefilling of keyhole at the top metal level with photoresist to prevent passivation damage even for a severe top metal rule (2001-09-25),

15. 6274426 - Self-aligned contact process for a crown shaped dynamic random access memory capacitor structure (2001-08-14),

Title: Innovations of Yu-Hua Lee in Microelectronics

Introduction

Yu-Hua Lee, an accomplished inventor based in Hsinchu, Taiwan, holds an impressive portfolio of 41 patents. His innovations primarily focus on advancing microelectronic fabrication processes, particularly in semiconductor manufacturing.

Latest Patents

Among his latest patents is a key-hole free process for high aspect ratio gap filling with reentrant spacer. This novel method optimizes the deposition of plasma-enhanced (PE) oxide or PE tetraethylorthosilicate (TEOS). The process involves utilizing an HDP-oxide over a polysilicon pattern, followed by etch back and plasma-enhanced silicon nitride deposition. The innovative approach ensures that the final layer of either PE-oxide or PE-TEOS is deposited without the formation of keyholes, significantly enhancing the reliability of the microelectronic structures.

Another notable patent is the laminated silicate glass layer etch stop method for fabricating microelectronic products. This method employs an undoped silicate glass layer as an etch stop when etching a doped silicate glass layer using an anhydrous hydrofluoric acid etchant. This technology is particularly beneficial for forming patterned salicide blocking dielectric layers while fabricating complementary metal oxide semiconductor (CMOS) devices.

Career Highlights

Yu-Hua Lee has held significant positions in leading organizations, including Taiwan Semiconductor Manufacturing Company Ltd. and the Industrial Technology Research Institute. His experience in these prestigious institutions has greatly contributed to his achievements in the field of microelectronics.

Collaborations

Throughout his career, Yu-Hua Lee has collaborated with notable professionals such as Cheng-Ming Wu. These partnerships have likely fostered innovation and sparked advancements in semiconductor technology.

Conclusion

Yu-Hua Lee's contributions to microelectronics and semiconductor manufacturing reflect his dedication to innovation. His extensive patent portfolio signifies his role as a key player in enhancing fabrication processes within the industry. As he continues to develop groundbreaking technologies, his influence on microelectronics will undoubtedly endure.

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