The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Nov. 29, 2004
Chia-hung Lai, Hsin-Chu, TW;
Jiunn-jyi Lin, Hsin-Chu, TW;
Tzong-sheng Chang, Hsin-Chu, TW;
Min Cao, Hsin-Chu, TW;
Huan-chi Tseng, Hsin-Chu, TW;
Yu-hua Lee, Hsin-Chu, TW;
Chin-tien Yang, Hsin-Chu, TW;
Chia-Hung Lai, Hsin-Chu, TW;
Jiunn-Jyi Lin, Hsin-Chu, TW;
Tzong-Sheng Chang, Hsin-Chu, TW;
Min Cao, Hsin-Chu, TW;
Huan-Chi Tseng, Hsin-Chu, TW;
Yu-Hua Lee, Hsin-Chu, TW;
Chin-Tien Yang, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A novel method of forming a bond pad of a semiconductor device and a novel bond pad structure. Two passivation layers are used to form bond pads of a semiconductor device. A portion of the second passivation layer resides between adjacent bond pads, preventing shorting of the bond pads during subsequent wire bonding processes or flip-chip packaging processes.