Ying-Hao Kuo

This inventor holds 85 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging (CPC class H01L21-568). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2023.

USPTO Granted Patents = 85 (Patent Applications = 1)

% Patents Active = 80.0

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 123(Granted Patents)

Forward Citations (Not Self Cited) = 65(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

85 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2023

Loading Chart...

Areas of Expertise:

Heat Dissipation

Semiconductor Package

Optical Device

Bio-Chip Package

Waveguide

Thermally Conductive

Adhesion Promoter

Heterogeneous Integration

Carbon Nano Material

Photodetector

Etching Process

Temporary Bonding

85 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11658044 - Thermally conductive structure for heat dissipation in semiconductor packages (2023-05-23),

2. 11574886 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2023-02-07),

3. 11415762 - Optical bench, method of making and method of using (2022-08-16),

4. 11328972 - Temporary bonding scheme (2022-05-10),

5. 11243353 - Semiconductor device and method of manufacturing (2022-02-08),

6. 11088058 - Method for forming semiconductor package using carbon nano material in molding compound (2021-08-10),

7. 11060977 - Bio-chip package with waveguide integrated spectrometer (2021-07-13),

8. 10983278 - Adhesion promoter apparatus and method (2021-04-20),

9. 10957559 - Thermally conductive structure for heat dissipation in semiconductor packages (2021-03-23),

10. 10866374 - Optical bench on substrate and method of making the same (2020-12-15),

11. 10866362 - Etchant and etching process for substrate of a semiconductor device (2020-12-15),

12. 10866361 - Method of making a metal grating in a waveguide and device formed (2020-12-15),

13. 10861817 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2020-12-08),

14. 10859860 - Electro-optic modulator device, optical device and method of making an optical device (2020-12-08),

15. 10840231 - Semiconductor device and method of manufacturing (2020-11-17),

Title: The Innovative Journey of Ying-Hao Kuo

Introduction: Ying-Hao Kuo, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Kuo's latest patents showcase his commitment to pushing the boundaries of technology, with a focus on advancements in semiconductor manufacturing processes and renewable energy solutions.

Career Highlights: With a career spanning over two decades, Ying-Hao Kuo has established himself as a leading figure in the tech industry. His work has not only revolutionized existing technologies but has also paved the way for future innovations in various sectors.

Collaborations: Throughout his career, Kuo has collaborated with top research institutions, leading tech companies, and academic experts to further his research and bring his inventions to life. His collaborative spirit has been instrumental in the success of many projects.

Conclusion: Ying-Hao Kuo's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his position as a trailblazer in the world of inventions. His work continues to inspire future generations of inventors and innovators.