The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Nov. 25, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chun-Hao Tseng, Taichung, TW;

Ying-Hao Kuo, Hsinchu, TW;

Kuo-Chung Yee, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 21/568 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/3128 (2013.01); H01L 23/4334 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01);
Abstract

The present disclosure, in some embodiments, relates to a semiconductor package. The semiconductor package includes a first chip and a second chip attached to a substrate. A thermal conductivity layer is attached to the first chip. A molding compound laterally surrounds the first chip, the second chip, and the thermal conductivity layer. The second chip extends from the substrate to an imaginary horizontally extending line that extends along a horizontally extending surface of the thermal conductivity layer facing away from the substrate. The imaginary horizontally extending line is parallel to the horizontally extending surface.


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