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For the Inventor, By the Inventor

Taichung, Taiwan

Chun-Hao Tseng

This inventor holds 42 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Massachusetts Institute of Technology, Haynes and Boone, LLP. Active years: 2012-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Hao Tseng. Retrieved from https://idiyas.com/inventor/chun-hao-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 42

% Patents Active = 85.7

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 83(Granted Patents)


Company Filing History:

goldMedal38 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 8,594 
 
Massachusetts Institute of Technology
 patents
bronzeMedal1 out of 5 
 
Haynes and Boone, LLP
 patents

Years Active: 2012-2023

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Areas of Expertise:
Thermally Conductive Structure
Heat Dissipation
Semiconductor Packages
Waveguide Fabrication
Optical Chip
Heterogeneous Integration
Adhesion Promoter
Carbon Nano Material
Molding Compound
Mask-Pellicle System
Nanoparticle Synthesis
Laser Chip Package
42 patents (USPTO):Explore Patents
1. 11658044 - Thermally conductive structure for heat dissipation in semiconductor packages (2023-05-23),
2. 11574886 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2023-02-07),
3. 11125940 - Method of fabrication polymer waveguide (2021-09-21),
4. 11088058 - Method for forming semiconductor package using carbon nano material in molding compound (2021-08-10),
5. 10983278 - Adhesion promoter apparatus and method (2021-04-20),
6. 10957559 - Thermally conductive structure for heat dissipation in semiconductor packages (2021-03-23),
7. 10861817 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2020-12-08),
8. 10859908 - Method to fabricate mask-pellicle system (2020-12-08),
9. 10784227 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2020-09-22),
10. 10748825 - Package and method for integration of heterogeneous integrated circuits (2020-08-18),
11. 10541154 - Thermally conductive structure for heat dissipation in semiconductor packages (2020-01-21),
12. 10539751 - Optical bench on substrate (2020-01-21),
13. 10510707 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2019-12-17),
14. 10490492 - Method for forming semiconductor package using carbon nano material in molding compound (2019-11-26),
15. 10408998 - Method of fabrication polymer waveguide (2019-09-10),

Title: Chun-Hao Tseng: Pioneering Inventor from Taichung

Introduction: Chun-Hao Tseng is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tseng holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Tseng has worked with leading tech companies and research institutions, spearheading projects that have led to significant advancements in various industries.

Collaborations: Tseng has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing to drive progress in the ever-evolving tech landscape.

Conclusion: Chun-Hao Tseng's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible make him a true visionary in the world of inventors. His work continues to inspire and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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