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Taichung, Taiwan

Chun-Hao Tseng

USPTO Granted Patents = 42

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 82(Granted Patents)

Company Filing History:

38 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Massachusetts Institute of Technology

Haynes and Boone, Llp

Years Active: 2012-2023

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Areas of Expertise:

Thermally Conductive Structure

Semiconductor Packages

Polymer Waveguide

Carbon Nano Material

Heterogeneous Integrated Circuits

Optical Bench

Vacuum Carrier Module

Adhesion Promoter

Chip Package

Light Coupling

Nanoparticle Synthesis

Nanowire Synthesis

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11658044 - Thermally conductive structure for heat dissipation in semiconductor packages (2023-05-23),

2. 11574886 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2023-02-07),

3. 11125940 - Method of fabrication polymer waveguide (2021-09-21),

4. 11088058 - Method for forming semiconductor package using carbon nano material in molding compound (2021-08-10),

5. 10983278 - Adhesion promoter apparatus and method (2021-04-20),

6. 10957559 - Thermally conductive structure for heat dissipation in semiconductor packages (2021-03-23),

7. 10861817 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2020-12-08),

8. 10859908 - Method to fabricate mask-pellicle system (2020-12-08),

9. 10784227 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2020-09-22),

10. 10748825 - Package and method for integration of heterogeneous integrated circuits (2020-08-18),

11. 10541154 - Thermally conductive structure for heat dissipation in semiconductor packages (2020-01-21),

12. 10539751 - Optical bench on substrate (2020-01-21),

13. 10510707 - Thermally conductive molding compound structure for heat dissipation in semiconductor packages (2019-12-17),

14. 10490492 - Method for forming semiconductor package using carbon nano material in molding compound (2019-11-26),

15. 10408998 - Method of fabrication polymer waveguide (2019-09-10),

Title: Chun-Hao Tseng: Pioneering Inventor from Taichung

Introduction: Chun-Hao Tseng is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tseng holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Tseng has worked with leading tech companies and research institutions, spearheading projects that have led to significant advancements in various industries.

Collaborations: Tseng has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing to drive progress in the ever-evolving tech landscape.

Conclusion: Chun-Hao Tseng's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible make him a true visionary in the world of inventors. His work continues to inspire and shape the future of technology.

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