The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Nov. 15, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/13 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); G02B 6/43 (2006.01); G02B 6/132 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); G02B 6/12002 (2013.01); G02B 6/13 (2013.01); G02B 6/4232 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/48 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); G02B 6/132 (2013.01); G02B 6/43 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/00 (2013.01); H01L 2924/013 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.