The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Dec. 31, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 21/02076 (2013.01); H01L 21/568 (2013.01); H01L 23/293 (2013.01); H01L 23/544 (2013.01); H01L 24/83 (2013.01); H01L 24/96 (2013.01); H01L 24/98 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/832 (2013.01); H01L 2224/8349 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83896 (2013.01); H01L 2924/065 (2013.01); H01L 2924/068 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01);
Abstract
A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer.