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Yi Heng Tsai

This inventor holds 28 USPTO granted patents and 4 published patent applications, primarily in MEMS Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2025.

USPTO Granted Patents = 28 (Patent Applications = 4)

% Patents Active = 75.0

Average Co-Inventor Count = 4.2

ph-index = 5

Forward Citations = 199(Granted Patents)

Company Filing History:

28 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2025

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Areas of Expertise:

Hybrid Ultrasonic Transducer

Piezoelectric Device

MEMS Structure

Semiconductor Bonding

Electrical Bypass

VHF Etch Barrier

Integration Scheme

Cavity Structure

Thin Substrate Handling

TSV Support Structure

Microstructure Device

Capacitor Integration

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12377441 - Hybrid ultrasonic transducer system (2025-08-05),

2. 12082505 - Integrated heater (and related method) to recover degraded piezoelectric device performance (2024-09-03),

3. 11984261 - Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device (2024-05-14),

4. 11736037 - MEMS structure and method of forming same (2023-08-22),

5. 11730058 - Integrated heater (and related method) to recover degraded piezoelectric device performance (2023-08-15),

6. 11508902 - Hybrid ultrasonic transducer and method of forming the same (2022-11-22),

7. 11289568 - Reduction of electric field enhanced moisture penetration by metal shielding (2022-03-29),

8. 11107630 - Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device (2021-08-31),

9. 10944041 - Hybrid ultrasonic transducer and method of forming the same (2021-03-09),

10. 10541627 - MEMS structure and method of forming same (2020-01-21),

11. 9859819 - MEMS structure and method of forming same (2018-01-02),

12. 9502370 - Semiconductor bonding structure and process (2016-11-22),

13. 9493346 - Capacitor with planarized bonding for CMOS-MEMS integration (2016-11-15),

14. 9449867 - VHF etch barrier for semiconductor integrated microsystem (2016-09-20),

15. 9422153 - Support structure for TSV in MEMS structure (2016-08-23),

Title: Yi Heng Tsai - Innovative Inventor from Hsinchu

Introduction: Yi Heng Tsai is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yi Heng Tsai holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials, showcasing his diverse expertise and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Yi Heng Tsai has worked with leading research institutions and technology companies, playing a pivotal role in developing cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Yi Heng Tsai has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Yi Heng Tsai's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his reputation as a visionary inventor in the global innovation landscape.

Profile summary based on public USPTO records.

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