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Hsin-Chu, Taiwan

Yao-Chun Chuang

USPTO Granted Patents = 69 (Patent Applications = 45)

Average Co-Inventor Count = 4.8

ph-index = 7

Forward Citations = 167(Granted Patents)

Forward Citations (Not Self Cited) = 151(Dec 10, 2025)

Location History:

Changhua County, TW (2022)
Taipei, TW (2012 - 2023)
Hsin-Chu, TW (2014 - 2023)
Hsinchu, TW (2024)

Company Filing History:

66 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Realtek Semiconductor Inc.

Years Active: 2012-2025

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Areas of Expertise:

Semiconductor Packaging

Integrated Circuits

Fan-Out Package Structures

Through Silicon Vias

Stress Reduction Techniques

Bump On Pad Bonding

Interposer Design

Dielectric Layer Control

Connector Structures

Heat Dissipation Features

Crack Prevention

Data Processing Devices

69 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12476178 - Reduction of cracks in redistribution structure (2025-11-18),

2. 12469807 - Fan-out package structures with cascaded openings in enhancement layer (2025-11-11),

3. 12463678 - Inquirer-side circuit supporting asymmetry data mode (2025-11-04),

4. 12445161 - Inquirer-side circuit capable of operating in asymmetry data mode (2025-10-14),

5. 12442742 - Test structures to determine integrated circuit bonding energies and methods of making and using the same (2025-10-14),

6. 12424558 - Bridge die having different surface orientation than IC dies interconnected by the bridge die (2025-09-23),

7. 12388047 - Integrated fan-out platform and manufacturing method for semiconductor devices (2025-08-12),

8. 12382587 - Methods and systems for improving surface mount joinder (2025-08-05),

9. 12362307 - Semiconductor package with ball grid array connection having improved reliability (2025-07-15),

10. 12362246 - Interposer including stepped surfaces and methods of forming the same (2025-07-15),

11. 12354975 - Guard ring structure (2025-07-08),

12. 12354946 - Delamination control of dielectric layers of integrated circuit chips (2025-07-08),

13. 12334465 - Semiconductor package and method of forming same (2025-06-17),

14. 12322716 - Heat dissipating features for laser drilling process (2025-06-03),

15. 12288735 - Through via structure (2025-04-29),

Title: Inventor Yao-Chun Chuang: Revolutionizing Technology in Hsin-Chu

Introduction: Yao-Chun Chuang is a visionary inventor hailing from Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Yao-Chun Chuang holds several patents in the areas of semiconductor technology, nanotechnology, and renewable energy solutions, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Chuang has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant advancements in the industry.

Collaborations: Throughout his career, Yao-Chun Chuang has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange.

Conclusion: Yao-Chun Chuang's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true pioneer in the field, inspiring the next generation of inventors and researchers.

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