Company Filing History:

10 out of 13,684

Applied Materials, Inc.

patents

2 out of 3,768

Lam Research Corporation

patents

1 out of 3

Appiled Materials, Inc.

5. 2 out of 832,680

Other

patents

Years Active: 2001-2012

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16 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8292697 - Method for manufacturing a hybrid composite wafer carrier for wet clean equipment (2012-10-23),

2. 8279577 - Substrate support having fluid channel (2012-10-02),

3. 8146902 - Hybrid composite wafer carrier for wet clean equipment (2012-04-03),

4. 8056858 - Device and method for providing radiation occlusion and aero-thermal protection (2011-11-15),

5. 7768765 - Substrate support having heat transfer system (2010-08-03),

6. 7221553 - Substrate support having heat transfer system (2007-05-22),

7. 6795292 - Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber (2004-09-21),

8. 6736668 - High temperature electrical connector (2004-05-18),

9. 6676760 - Process chamber having multiple gas distributors and method (2004-01-13),

10. 6583980 - Substrate support tolerant to thermal expansion stresses (2003-06-24),

11. 6572814 - Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas (2003-06-03),

12. 6538872 - Electrostatic chuck having heater and method (2003-03-25),

13. 6503368 - Substrate support having bonded sections and method (2003-01-07),

14. 6490146 - Electrostatic chuck bonded to base with a bond layer and method (2002-12-03),

15. 6462928 - Electrostatic chuck having improved electrical connector and method (2002-10-08),

Title: Wing Lau Cheng: Innovator in Substrate Processing Technology

Introduction

Wing Lau Cheng is a prominent inventor based in Sunnyvale, CA, with a remarkable portfolio of 16 patents. His work primarily focuses on advancements in substrate processing technology, which plays a crucial role in various manufacturing processes.

Latest Patents

Among his latest innovations is a patent for a method of manufacturing a hybrid composite wafer carrier for wet clean equipment. This invention describes a carrier structure designed to support a substrate during processing. The method involves creating a composite frame with a carbon fiber core, along with layers of polymer material and aramid fabric. Additionally, he has developed a substrate support featuring a fluid channel, which enhances the efficiency of substrate processing chambers by utilizing a heat transfer fluid.

Career Highlights

Wing Lau Cheng has made significant contributions to the field through his work at Applied Materials, Inc. His experience in this leading company has allowed him to refine his skills and innovate in substrate processing technologies.

Collaborations

Throughout his career, Cheng has collaborated with notable professionals, including Arnold Kholodenko and Semyon L Kats. These partnerships have further enriched his work and contributed to the development of advanced technologies in the industry.

Conclusion

Wing Lau Cheng's contributions to substrate processing technology demonstrate his innovative spirit and commitment to advancing manufacturing processes. His patents reflect a deep understanding of materials and engineering, positioning him as a key figure in the field.

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