San Jose, CA, United States of America

Wei Lei

This inventor holds 22 USPTO granted patents and 13 published patent applications, primarily in Tungsten Gap Fill Technology. Top assignees: Applied Materials, Inc., Novellus Systems Incorporated, Lam Research Corporation. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei Lei. Retrieved from https://idiyas.com/inventor/wei-lei-fa9ad2xp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 95.5

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 67(Granted Patents)


Location History:

  • Santa Clara, CA (US) (2012 - 2014)
  • San Jose, CA (US) (2017 - 2018)
  • Campbell, CA (US) (2022)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Tungsten Gap Fill
Dielectric Protection
Physical Vapor Deposition
Chemical Vapor Deposition
Low Resistivity Films
Selective Deposition
Contact Resistance
Magnetic Fields
Cobalt-Titanium Structures
Ternary Films
Interconnect Structures
Metal Removal
22 patents (USPTO):Explore Patents

Title: Wei Lei: Visionary Inventor Shaping the Future of Technology

Introduction: Wei Lei, based in San Jose, CA, is a man whose passion for innovation and relentless drive to create a positive impact through his inventions solidifies his position as a visionary inventor shaping the future of technology. His innovative spirit and dedication to excellence have led to the creation of several groundbreaking patents.

Latest Patents:

1. "Methods and apparatus for controlling contact resistance in cobalt-titanium structures": This patent showcases Wei Lei's expertise in creating reduced contact resistance for cobalt-titanium structures. By utilizing a combination of different deposition processes, Lei has introduced a method that enhances the performance of these structures significantly.

2. "Methods for selective deposition of tungsten atop a dielectric layer for bottom-up gapfill": This patent highlights Wei Lei's ingenuity in selectively depositing a tungsten layer atop a dielectric surface. The method involves intricate steps to ensure precise deposition and oxidation, resulting in improved gap filling capabilities for electronic devices.

Career Highlights: Wei Lei has made significant contributions to the field of technology through his work at companies like Applied Materials, Inc., and Novellus Systems Incorporated. His expertise in semiconductor manufacturing processes has been instrumental in shaping the industry's landscape.

Collaborations: Throughout his career, Wei Lei has collaborated with talented individuals such as Juwen Gao and Tae Hong Ha. These collaborations have not only enriched Lei's own work but have also contributed to the collective innovation within the organizations he has been a part of.

Conclusion: Wei Lei's innovative mindset, coupled with his technical expertise, has positioned him as a trailblazer in the realm of technology. His patents reflect a deep understanding of complex engineering processes and a commitment to pushing the boundaries of what is possible. As Wei Lei continues to drive innovation forward, the impact of his inventions is sure to resonate across various industries for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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