The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Jul. 09, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventor:
Wei Lei, Campbell, CA (US);
Assignee:
Applied Materials Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/02 (2006.01); C23C 16/08 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
C23C 16/08 (2013.01); C23C 16/0227 (2013.01); C23C 16/0281 (2013.01); C23C 16/34 (2013.01); C23C 16/402 (2013.01);
Abstract
Methods for forming tungsten gap fill on a feature. A method for forming tungsten gap fill in a feature can include: treating a first layer on a substrate having a portion of the first layer exposed through the feature; depositing a tungsten liner layer atop the treated portion of the first layer in the feature using a physical vapor deposition (PVD) process; and depositing a tungsten fill layer into the feature and atop the tungsten liner layer using a chemical vapor deposition (CVD) process.