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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Viren V Khandekar

This inventor holds 24 USPTO granted patents and 3 published patent applications, primarily in Wafer-Level Packaging. Top assignees: Maxim Integrated Products, Inc., Intel Corporation, Other. Active years: 2006-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Viren V Khandekar. Retrieved from https://idiyas.com/inventor/viren-v-khandekar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 91.7

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 198(Granted Patents)


Location History:

  • Chandler, AZ (US) (2006 - 2009)
  • Flower Mound, TX (US) (2011 - 2022)

Company Filing History:

goldMedal19 out of 1,298 
 
Maxim Integrated Products, Inc.
 patents
silverMedal3 out of 56,322 
 
Intel Corporation
 patents
bronzeMedal2 out of 834,513 
Other
 patents

Years Active: 2006-2022

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Areas of Expertise:
Integrated Circuit Testing
Chip-to-Wafer Integration
Wafer-Level Package
Solder Bump Process
QFN Packages
Thermal Expansion
Shock Absorber Functionality
Multi-Die Packaging
Reliability Enhancements
Passive Device Integration
Solder Fatigue
Self Alignment Features
24 patents (USPTO):Explore Patents
1. 11428735 - System for monitoring and controlling an integrated circuit testing machine (2022-08-30),
2. 10804233 - Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height (2020-10-13),
3. 10304758 - Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active wafer (2019-05-28),
4. 10032749 - Three-dimensional chip-to-wafer integration (2018-07-24),
5. 9721912 - Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality (2017-08-01),
6. 9583425 - Solder fatigue arrest for wafer level package (2017-02-28),
7. 9472451 - Technique for wafer-level processing of QFN packages (2016-10-18),
8. 9425064 - Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages (2016-08-23),
9. 9324687 - Wafer-level passive device integration (2016-04-26),
10. 9230903 - Multi-die, high current wafer level package (2016-01-05),
11. 9219043 - Wafer-level package device having high-standoff peripheral solder bumps (2015-12-22),
12. 9190391 - Three-dimensional chip-to-wafer integration (2015-11-17),
13. 9093333 - Integrated circuit device having extended under ball metallization (2015-07-28),
14. 9087779 - Multi-die, high current wafer level package (2015-07-21),
15. 9087732 - Wafer-level package device having solder bump assemblies that include an inner pillar structure (2015-07-21),

Title: Viren V Khandekar: A Visionary Innovator Making Waves in the World of Technology

Introduction: Viren V Khandekar, a distinguished inventor based in Chandler, AZ, has captured the essence of innovation with his relentless pursuit of pioneering solutions that make a positive impact on society. With an impressive portfolio of 24 patents to his name, Khandekar has solidified his position as a prominent figure in the realm of inventors.

Latest Patents: Among his recent breakthroughs is the development of a cutting-edge "System for monitoring and controlling an integrated circuit testing machine". This system leverages advanced technology such as vibration sensors and machine control signals to enhance the efficiency and accuracy of IC testing processes. Additionally, Khandekar has also patented a "Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height", showcasing his knack for addressing intricate technical challenges with practical solutions.

Career Highlights: Khandekar has made significant contributions to the tech industry through his work with renowned companies such as Maxim Integrated Products, Inc. and Intel Corporation. His innovative spirit and technical expertise have been instrumental in driving forward the development of next-generation semiconductor devices and testing technologies.

Collaborations: Throughout his career, Khandekar has collaborated with industry peers such as Karthik Thambidurai and Arkadii V Samoilov, forming dynamic teams that have spearheaded groundbreaking projects and achieved notable milestones in the field of technology.

Conclusion: Viren V Khandekar's passion for innovation, coupled with his exceptional talent for problem-solving, exemplifies his unwavering dedication to pushing the boundaries of technological advancement. His visionary approach and remarkable contributions continue to shape the future of technology, earning him a well-deserved reputation as a trailblazer in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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