The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Nov. 16, 2015
Applicant:
Maxim Integrated Products, Inc., San Jose, CA (US);
Inventors:
Amit S. Kelkar, Flower Mound, TX (US);
Karthik Thambidurai, Plano, TX (US);
Viren Khandekar, Flower Mound, TX (US);
Hien D. Nguyen, The Colony, TX (US);
Assignee:
Maxim Integrated Products, Inc., San Jose, CA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/25 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01);
Abstract
An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and the conductive pillar extends through the overmold.