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For the Inventor, By the Inventor

Flower Mound, TX, United States of America

Amit Subhash Kelkar

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 50(Granted Patents)


Company Filing History:

goldMedal14 out of 1,284 
 
Maxim Integrated Products, Inc.
 patents

Years Active: 2012-2018

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14 patents (USPTO):Explore Patents
1. 10134689 - Warpage compensation metal for wafer level packaging technology (2018-11-20),
2. 10032749 - Three-dimensional chip-to-wafer integration (2018-07-24),
3. 9704809 - Fan-out and heterogeneous packaging of electronic components (2017-07-11),
4. 9472451 - Technique for wafer-level processing of QFN packages (2016-10-18),
5. 9331048 - Bonded stacked wafers and methods of electroplating bonded stacked wafers (2016-05-03),
6. 9324687 - Wafer-level passive device integration (2016-04-26),
7. 9219043 - Wafer-level package device having high-standoff peripheral solder bumps (2015-12-22),
8. 9190391 - Three-dimensional chip-to-wafer integration (2015-11-17),
9. 9040386 - Method for varied topographic MEMS cap process (2015-05-26),
10. 9000587 - Wafer-level thin chip integration (2015-04-07),
11. 8970043 - Bonded stacked wafers and methods of electroplating bonded stacked wafers (2015-03-03),
12. 8878350 - Semiconductor device having a buffer material and stiffener (2014-11-04),
13. 8860222 - Techniques for wafer-level processing of QFN packages (2014-10-14),
14. 8124916 - Thermal processing of silicon wafers (2012-02-28),

Title: The Innovative Contributions of Amit Subhash Kelkar

Introduction

Amit Subhash Kelkar is a prominent inventor based in Flower Mound, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on enhancing the efficiency and performance of integrated circuit devices.

Latest Patents

One of his latest patents is related to warpage compensation metal for wafer level packaging technology. This invention discloses a wafer level package device and method that includes a warpage compensation metal adhered to the backside of a semiconductor wafer. This innovation minimizes warpage of the semiconductor wafer, where multiple metal features have been formed on the device side of the semiconductor substrate. The warpage compensation metal may include a copper film, which is crucial for maintaining the integrity of the semiconductor device.

Another notable patent is for three-dimensional chip-to-wafer integration. This integrated circuit device includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and the conductive pillar extends through the overmold, enhancing the connectivity and performance of the device.

Career Highlights

Amit Kelkar is currently employed at Maxim Integrated Products, Inc., where he continues to innovate and develop cutting-edge technologies. His expertise in semiconductor packaging and integration has positioned him as a key player in the industry.

Collaborations

Throughout his career, Amit has collaborated with talented professionals, including Viren V Khandekar and Karthik Thambidurai. These collaborations have fostered an environment of innovation and creativity, leading to the development of advanced technologies.

Conclusion

Amit Subhash Kelkar's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of integrated circuit devices, making significant strides in the industry.

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