The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Feb. 01, 2011
Applicants:

Quanbo Zou, Plano, TX (US);

Uppili Sridhar, Plano, TX (US);

Amit S. Kelkar, Flower Mound, TX (US);

Xuejun Ying, San Jose, CA (US);

Inventors:

Quanbo Zou, Plano, TX (US);

Uppili Sridhar, Plano, TX (US);

Amit S. Kelkar, Flower Mound, TX (US);

Xuejun Ying, San Jose, CA (US);

Assignee:

Maxim Integrated Products, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); C25D 17/00 (2006.01); B81C 3/00 (2006.01); C25D 7/12 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); B81C 3/001 (2013.01); C25D 7/123 (2013.01); C25D 17/005 (2013.01); C25D 17/007 (2013.01); H01L 23/481 (2013.01); H01L 25/50 (2013.01); B81C 2201/0197 (2013.01); B81C 2203/035 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 2224/13144 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/10253 (2013.01);
Abstract

A wafer structure includes a first wafer stack and a first bonding layer disposed on the first wafer stack. The wafer structure further includes a second wafer stack that includes a first surface and a second surface opposing the first surface. A second bonding layer is disposed on the second surface and is in contact with the first bonding layer. The second wafer stack comprises through-silicon-vias (TSVs) that extend from the first surface to the second bonding layer. A seed layer is disposed on the first surface and is in contact with the TSVs.


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