Singapore, Singapore

Quanbo Zou


Average Co-Inventor Count = 3.1

ph-index = 9

Forward Citations = 325(Granted Patents)


Location History:

  • Singapore, SG (2002 - 2008)
  • Plano, TX (US) (2008 - 2016)

Company Filing History:


Years Active: 2002-2016

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13 patents (USPTO):Explore Patents

Title: **Innovations of Quanbo Zou: Advancements in Wafer Technology**

Introduction

Quanbo Zou, an accomplished inventor based in Singapore, has made significant contributions to the field of microelectronics. With an impressive portfolio of 13 patents, Zou's work focuses on innovative methods related to wafer bonding and electroplating, showcasing his expertise and creativity in the industry.

Latest Patents

Among his latest patents, Zou has developed a method for creating bonded stacked wafers, which includes several key processes. This method involves providing a first wafer stack and applying a first bonding layer on it. A second wafer stack, containing vias, is then introduced, followed by the application of a second bonding layer that bonds to the first. The structure is enhanced with a seed layer, allowing for efficient electroplating by ensuring contact with the vias and extending over the wafer edges. This innovative wafer structure, featuring through-silicon-vias (TSVs), represents a significant advancement in the manufacturing processes for microelectronic devices.

Career Highlights

Quanbo Zou's career is highlighted by his time at prominent organizations such as the Institute of Microelectronics and Maxim Integrated Products, Inc. His experiences in these establishments have undoubtedly contributed to the development of his patented technologies and his overall understanding of the microelectronics landscape.

Collaborations

Throughout his career, Zou has collaborated with esteemed colleagues, including Uppili Sridhar and Yu Jau Chen. These collaborations have fostered an environment of innovation and allowed for the exchange of ideas, further enhancing the quality of his inventions.

Conclusion

In conclusion, Quanbo Zou stands out as a prominent inventor in the realm of microelectronics, with a robust portfolio of patents that underscore his innovative spirit. His work on bonded stacked wafers and methods of electroplating signifies a remarkable leap in technology, positioning him as a key player in shaping the future of semiconductor manufacturing.

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