The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2003
Filed:
Apr. 26, 2001
Applicant:
Inventors:
Yu Chen, Singapore, SG;
Quanbo Zou, Singapore, SG;
Uppili Sridhar, Singapore, SG;
Pang Dow Foo, Singapore, SG;
Assignee:
Institute of Microelectronics, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/131 ;
U.S. Cl.
CPC ...
H01L 2/131 ;
Abstract
A method of forming bonds between similar and dissimilar material surfaces particularly the surfaces of silicon wafers having various devices disposes thereon, wherein such bonds can be formed at room temperature and do not require the application of high pressures or voltages. The bonding material is polydimethylsiloxane, which is transparent and bio-compatible.