Hien D Nguyen

Title: Hien D Nguyen: Innovator in Semiconductor Technology

Introduction

Hien D Nguyen is a prominent inventor based in The Colony, Texas, known for his significant contributions to semiconductor technology. With a total of five patents to his name, Nguyen has made remarkable advancements in integrated circuit devices and semiconductor packaging.

Latest Patents

Nguyen's latest patents include innovative technologies such as three-dimensional chip-to-wafer integration. This patent describes an integrated circuit device that features a semiconductor substrate with a die attached. A conductive pillar connects to either the semiconductor substrate or the die, with an overmold molded onto the substrate over the die, allowing the conductive pillar to extend through the overmold. Another notable patent is for a technique for wafer-level processing of QFN packages. This patent outlines semiconductor package devices that utilize pillars for electrical interconnectivity, including an integrated circuit chip with at least one pillar formed over it, designed to provide essential electrical connections.

Career Highlights

Hien D Nguyen is currently employed at Maxim Integrated Products, Inc., where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing advanced technologies that enhance the performance and efficiency of electronic devices.

Collaborations

Nguyen collaborates with talented professionals in the field, including Amit Subhash Kelkar and Viren V Khandekar, contributing to a dynamic and innovative work environment.

Conclusion

Hien D Nguyen's contributions to semiconductor technology through his patents and work at Maxim Integrated Products, Inc. highlight his role as a leading inventor in the industry. His innovative approaches continue to shape the future of electronic devices.