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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Veronica Aleman Strong

USPTO Granted Patents = 38 

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 72(Granted Patents)


Location History:

  • Chandler, AZ (US) (2019 - 2023)
  • Hillsboro, OR (US) (2021 - 2024)

Company Filing History:

goldMedal37 out of 54,781 
 
Intel Corporation
 patents
silverMedal1 out of 832,891 
Other
 patents

Years Active: 2019-2025

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38 patents (USPTO):Explore Patents
1. 12444619 - Physical vapor deposition seeding for high aspect ratio vias in glass core technology (2025-10-14),
2. 12424719 - Compact surface transmission line waveguides with vertical ground planes (2025-09-23),
3. 12424716 - RF filters and multiplexers manufactured in the core of a package substrate using glass core technology (2025-09-23),
4. 12400934 - Dielectric film coating for through glass vias and plane surface roughness mitigation (2025-08-26),
5. 12368091 - Package substrate with glass core having vertical power planes for improved power delivery (2025-07-22),
6. 12347761 - Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate (2025-07-01),
7. 12205902 - High-density interconnects for integrated circuit packages (2025-01-21),
8. 11942334 - Microelectronic assemblies having conductive structures with different thicknesses (2024-03-26),
9. 11784181 - Die backend diodes for electrostatic discharge (ESD) protection (2023-10-10),
10. 11751367 - Microelectronic package electrostatic discharge (ESD) protection (2023-09-05),
11. 11749628 - Sacrificial redistribution layer in microelectronic assemblies having direct bonding (2023-09-05),
12. 11728258 - Electroless metal-defined thin pad first level interconnects for lithographically defined vias (2023-08-15),
13. 11694951 - Zero-misalignment two-via structures (2023-07-04),
14. 11676918 - Electrostatic discharge protection in integrated circuits (2023-06-13),
15. 11664303 - Interconnection structure fabrication using grayscale lithography (2023-05-30),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I'll create an article about inventor Veronica Aleman Strong based on the provided data.

Title: The Innovative Mind of Veronica Aleman Strong

Introduction:

Veronica Aleman Strong, a prolific inventor hailing from Hillsboro, OR, has made significant contributions to the field of microelectronics with her groundbreaking patents. Her inventive spirit and dedication to pushing the boundaries of technology have earned her a place of distinction in the industry.

Latest Patents:

Veronica Aleman Strong's latest patents showcase her expertise in microelectronic assemblies. One notable invention is the "Microelectronic Assemblies Having Conductive Structures with Different Thicknesses." This patent introduces a novel approach to constructing microelectronic assemblies, utilizing conductive traces with varying thicknesses to enhance performance and functionality. Another groundbreaking patent is the "Die Backend Diodes for Electrostatic Discharge (ESD) Protection," which innovatively addresses ESD protection in semiconductor devices, showcasing Veronica's ingenuity and technical prowess.

Career Highlights:

Veronica Aleman Strong has amassed an impressive portfolio of 31 patents, demonstrating her exceptional skills and innovative mindset. Throughout her career, she has honed her expertise while working at esteemed companies like Intel Corporation, where she has left an indelible mark on the microelectronics industry.

Collaborations:

Veronica Aleman Strong has collaborated with notable experts in the field, including her coworkers Aleksandar Aleksov and Johanna M. Swan. These collaborative efforts have led to the development of groundbreaking technologies and have further solidified Veronica's reputation as a visionary inventor.

Conclusion:

In conclusion, Veronica Aleman Strong's relentless pursuit of innovation and her passion for advancing technology have established her as a trailblazer in the field of microelectronics. Her impressive patent portfolio, coupled with her collaborations with industry experts, underscores her significant contributions to the realm of technological advancement. Veronica's work serves as a testament to the power of innovation and the impact it can have on shaping the future of technology.

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